Increased fracture toughness of additively manufactured semi-crystalline thermoplastics via thermal annealing
2020; Elsevier BV; Volume: 211; Linguagem: Inglês
10.1016/j.polymer.2020.123091
ISSN1873-2291
AutoresKevin R. Hart, Ryan M. Dunn, Eric D. Wetzel,
Tópico(s)Innovations in Concrete and Construction Materials
ResumoPolymeric components manufactured via freeform fabrication (FFF) typically have poor inter-laminar toughness resulting from incomplete bonding across layers during production. Here we study the effect of printing and post-processing on the inter-laminar toughness of additively manufactured semi-crystalline (poly-lactide (PLA)) structures. Specimens were subject to post-print thermal annealing to promote inter-laminar bonding, while post-annealing quenching rates were chosen to vary the induced degree of crystallinity in the final structure, as characterized via dynamic scanning calorimetry (DSC). Critical elastic-plastic strain energy release rates ( J Ic ) of annealed samples were evaluated using the single edge notched bend (SENB) geometry and post-testing fractography . The results show that as-printed PLA adopts an amorphous character with good inter-laminar toughness and ductility. Post-print annealing can double the toughness via increased interfacial wetting, but only if the material is quenched rapidly to preserve the amorphous character. In contrast, post-print annealing followed by slow cooling results in a semi-crystalline state (≈25% crystallinity) with low fracture toughness and brittle fracture behavior . • Inter-layer fracture toughness of an additively manufactured semi-crystalline polymer is highly sensitive to processing. • As-printed parts have low crystallinity and moderate interfacial wetting, leading to moderate fracture toughness. • Post-print annealing increases toughness via wetting, if the part is quenched after annealing to maintain low crystallinity. • Slow-cooling after annealing results in adequate wetting but high crystallinity, resulting in poor interlayer toughness.
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