Portal de Periódicos da CAPES

Hybrid Substrate by Fan-Out RDL-First Panel-Level Packaging

2021; Institute of Electrical and Electronics Engineers; Volume: 11; Issue: 8 Linguagem: Inglês

10.1109/tcpmt.2021.3096786

2156-3985

John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Ricky Tsun-Sheng Chou, Channing Cheng-Lin Yang, Hsing-Ning Liu, Tzyy-Jang Tseng,

Copper Interconnects and Reliability

The panel-level redistribution-layer (RDL)-first fan-out packaging for hybrid substrate is studied. Emphasis is placed on the process, materials, design, and fabrication of: 1) heterogeneous integration of one large chip and one small chip with 50- $\mu \text{m}$ pitch (minimum); 2) fine metal linewidth and spacing RDL-first substrate on a temporary panel carrier; 3) ordinary build-up package substrate on a panel; 4) hybrid substrate which is by soldering the RDL-first substrate on the build-up substrate; and 5) chips to hybrid substrate bonding and underfilling. Reliability assessment by thermomechanical simulation includes thermal cycling of the heterogeneous integration of the two-chip package on the hybrid substrate that is performed by a nonlinear temperature- and time-dependent finite-element analysis.