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Next-generation thermoelectric cooling modules based on high-performance Mg3(Bi,Sb)2 material

2021; Elsevier BV; Volume: 6; Issue: 1 Linguagem: Inglês

10.1016/j.joule.2021.11.008

2542-4785

Jiawei Yang, Guodong Li, Hangtian Zhu, Nan Chen, Tianbo Lu, Junling Gao, Liwei Guo, Junsen Xiang, Peijie Sun, Yuan Yao, Ronggui Yang, Huaizhou Zhao,

Advanced Thermodynamics and Statistical Mechanics

As the core component of any real thermoelectric cooling system, the Bi2Te3-based modules have been used for decades. Recently, n-type Mg3(Bi,Sb)2 material was proposed as a promising substitute for Bi2Te3. However, the fabrication of commercially viable modules with such new materials is challenging. Herein, full-scale cooling modules based on the optimized n-type Mg3.2Bi1.4975Sb0.5Te0.0025 and p-type (Sb0.75Bi0.25)2(Te0.97Se0.03)3 were successfully fabricated. A maximum ΔT of 76 K with the hot-side temperature of 350 K, a COP of 8 with a temperature difference of 5 K, and a serving time >6 months were achieved. These were attributed to the enhanced stability and well-secured n-type transport of the Mg3.2Bi1.4975Sb0.5Te0.0025, a highly reliable Mg2Cu barrier layer, and other key techniques involved in the module assembling. The most striking benefit of our modules lies in its 23% higher performance-cost ratio over commercial Bi2Te3 system, which paves its way for next-generation thermoelectric cooling applications.