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Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill

2022; Volume: 19; Issue: 1 Linguagem: Inglês

10.4071/imaps.1546248

1555-8037

Ricky Tsun-Sheng Chou, John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, Hsing-Ning Liu, Tzyy-Jang Tseng,

Electronic Packaging and Soldering Technologies

Abstract In this study, the heterogeneous integration of two chips on a 2.3D hybrid substrate using solder joint and underfill is investigated. Emphasis is placed on the materials, design, process, fabrication, and reliability of the package. Drop test and results of the package are also provided.