Packaging of high density fiber/laser modules using passive alignment techniques
1992; Institute of Electrical and Electronics Engineers; Volume: 15; Issue: 6 Linguagem: Inglês
10.1109/33.206916
ISSN1558-3082
AutoresM. S. Cohen, M.F. Cina, E. Bassous, M.M. Opyrsko, James L. Speidell, F.J. Canora, Mark DeFranza,
Tópico(s)Advanced Fiber Optic Sensors
ResumoA method for packaging a laser-fiber module is explored in which the critical laser-fiber alignment is carried out, not with the laser activated, but by a passive method based on the registration principles of photolithography. The method relies on an index scheme in which fiducial marks are lithographically placed on the laser chip and on a fiber carrier. At 850 nm, using the index technique with cleaved multimode fibers, it was possible to achieve the same laser-fiber coupling efficiency as attained by active alignment; with cleaved single-mode fibers about 80% of the active alignment coupling efficiency was achieved. Details of the index-alignment method are discussed, and a brief description of an improved computer-controlled version of the apparatus is given. >
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