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Building blocks of a flip-chip integrated superconducting quantum processor

2022; IOP Publishing; Volume: 7; Issue: 3 Linguagem: Inglês

10.1088/2058-9565/ac734b

2058-9565

Sandoko Kosen, Hang-Xi Li, Marcus Rommel, Daryoush Shiri, Christopher Warren, Leif Grönberg, Jaakko Salonen, Tahereh Abad, Janka Biznárová, Marco Caputo, Liangyu Chen, Kestutis Grigoras, Göran Johansson, Anton Frisk Kockum, Christian Križan, Daniel Pérez Lozano, Graham J. Norris, Amr Osman, Jorge Fernández-Pendás, Alberto Ronzani, Anita Fadavi Roudsari, Slawomir Simbierowicz, Giovanna Tancredi, Andreas Wallraff, Christopher Eichler, Joonas Govenius, Jonas Bylander,

Quantum Information and Cryptography

Abstract We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips—one quantum chip and one control chip—that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.