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Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip

2022; Institute of Electrical and Electronics Engineers; Volume: 12; Issue: 6 Linguagem: Inglês

10.1109/tcpmt.2022.3172618

2156-3985

Hengqian Yi, Efe Öztürk, Marco Koelink, Jana Krimmling, Andrei A. Damian, Wojciech Dębski, H.W. van Zeijl, Guoqi Zhang, René H. Poelma,

VLSI and Analog Circuit Testing

High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection is realized by through-polymer via (TPV) technology. The detailed fabrication process of the radar antenna-in-package (AiP) with TPV is discussed. The results from the functional tests of the radar AiP are presented and benchmarked to a commercial quad-flat no-leads (QFN) package with an open antenna cavity. The detection margin between the echo signal and the constant false alarm rate (CFAR) threshold is approximately 10 dB higher for the TPV radar AiP compared with the benchmarked commercial QFN package.