Voltar
Artigo Revisado por pares
BIBTEX RIS

Effect of Thermal & Mechanical Stresses on Novel Microstrip Lines Printed on Flexible Substrates

2024; Institute of Electrical and Electronics Engineers; Volume: 14; Issue: 8 Linguagem: Inglês

10.1109/tcpmt.2024.3412740

ISSN

2156-3985

Autores

Abdullah S. Obeidat, Emuobosan Enakerakpo, Ashraf Umar, Waleed Al-Shaibani, Mohamed Y. Abdelatty, Sara Lieberman, Olya Noruz Shamsian, Riadh Al-Haidari, Mohammed Alhendi, Mark D. Poliks,

Tópico(s)

Advanced Sensor and Energy Harvesting Materials

Referência(s)